MediaTek has announced a new chipset today, named as Helio P22. The new chipset is built on 12nm process especially with TSMC’s FinFET. This is first mid-range chipset to be manufactured under this process. The new chipset strikes an octa-core CPU with Cortex-A53 cores which can be clocked upto 2 GHz. The new MediaTek Helio P22 chipset will support dual-cameras functionality.It can fetch upto 13 MP + 8 MP resolutions with 30fps video recording feature
The power consumption is low for the Helio P22 chipset and and comes with highly capable hardware depth engine for real-time Bokeh preview. THe new MediaTek chipset supports upto 1600×720 resolutions, with aspect ratio of 20:9. It comes with dual-sim functionality and supports LTE feature for both the sims. It also has connectivity features as Bluetooth 5.0 and Wi-Fi 802.11ac band.
As the upgrades in technology has grown up fast, the new MediaTek chipset fills in the new technology. Yes it supports AI features and gives out the benefits of AI-accelerated experiences. MediaTek specified that the process of AI is achieved and implemented through common AI frameworks such as TensorFlow TF Lite, Caffe and Caffe2 etc,.
The new MediaTek Helio P22 is under pre-production process and will hit the devices by end of June 2018. Smartphones will be manufactured with the new chipset by the end of June 2018. As we expect the processing speed and new additional features will make this chipset a unique stand among the processor classifications. The comparison will be updated soon as after the release of the new chipset. Will wait and see the outstanding performance of the new processor.